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¼ø¼ö/Ãʼø¼öÁ¦Á¶½Ã½ºÅÛ
¼ø¼öÁ¦Á¶ÀåÄ¡
¿ª»ïÅõ¸·(R.O Membrane)¿¡ ÀÇÇÑ Ãʼø¼öÀÇ Á¦Á¶
Ãʼø¼ö¶õ ÀϹÝÀûÀ¸·Î 17§Û /cm~18§Û /cm Á¤µµÀÇ Àü±âÀû ÀúÇ× (Electrical resistivity)À» °¡Áø ¹°¸® ¡¤ÈÇÐÀûÀ¸·Î ÈÇÕ¹°Áú ¹× ÇÕ¼º¹°Áú µîÀÌ °ÅÀÇ Á¸ÀçÇÏÁö ¾Ê´Â °í¼øµµÀÇ ¼ø¼ö¸¦ ¸»ÇÑ´Ù . µû¶ó¼ Ãʼø¼ö Á¦Á¶ÀåÄ¡ÀÇ ÀÀ¿ëÀº »ç¿ë¸ñÀû ¹× ¿ä±¸µÇ´Â ¼öÁú (Quality)¿¡ µû¶ó SystemÀÇ ¼±ÅÃÀû ¼³°è°¡ ÇÊ¿äÇÏ¸ç ¸ñÀû¿¡ ÀûÇÕÇÑ Ãʼø¼ö¸¦ Áö¼ÓÀûÀ¸·Î »ý»êÇϱâ À§Çؼ´Â ÀåÄ¡ÀÇ ¿îÀü ¹× À¯Áö°ü¸®°¡ ¿ëÀÌÇÏ¿©¾ß ÇÑ´Ù . ¶ÇÇÑ Á¤±³ÇÑ System¿¡ ÀÇÇØ »ý»êµÈ Ãʼø¼ö´Â ÁÖÀ§È¯°æ ¹× Á¶°Ç¿¡ ÀÇÇØ ¹Î°¨ÇÑ º¯È¸¦ °¡Á® ¿Ã ¼ö ÀÖÀ¸¹Ç·Î ÀÌÀÇ º¸Á¸ ¹× °ü¸®¿¡ ÀÖ¾î¼ ¼¼½ÉÇÑ ÁÖÀǰ¡ ¿ä±¸µÈ´Ù. |
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¿ª»ïÅõ½Ä Ãʼø¼ö Á¦Á¶ÀåÄ¡¿¡ ÀÌ¿ëµÇ´Â ¹ÝÅõ¸· (Membrane)Àº °ÅÀÇ ¸ðµç °ø±Þ¿ø¼ö¿¡ ´ëÇÏ¿© 85%~99.8%ÀÇ ¿ì¼öÇÑ °íÇü¹°Áú Á¦°Å ´É·ÂÀ» °¡Áö°í ÀÖ´Ù . µû¶ó¼ ¿ª»ïÅõ¾Ð ó¸®ÀåÄ¡¿¡ ÀÇÇØ 1Â÷ ó¸®µÈ °ø±Þ¿ø¼ö¸¦ 2Â÷ ó¸®ÀåÄ¡ÀÎ À̿±³È¯ÀåÄ¡ (MBP-MIXED bed polisher sysstem)µî¿¡ Åë°ú½ÃÄÑ ÀÜ·ù °íÇü¹°Áú (À̿¹°Áú )À» Á¦°ÅÇÔÀ¸·Î½á Àü±âÀû ÀúÇ× (Electrical resistivity)10§Û /cm~18.3§Û /cmÀÇ Ãʼø¼ö¸¦ »ý»êÇØ³¾ ¼ö ÀÖ´Ù .
¿ª»ïÅõ ¹ÝÅõ¸·Àº ÃÖÀû Á¶°ÇÇÏ¿¡¼ 2~3³â°£ Áö¼ÓÀûÀ¸·Î »ç¿ëÀÌ °¡´ÉÇÏ¸ç °£´ÜÇÑ ¹æ¹ýÀ¸·Î ±³Ã¼ÇÒ ¼ö ÀÖ´Ù . ´Ù¸¸ ¹«±â¼º¹°Áú¿¡ ÀÇÇÑ ScaleÀÇ ¹ß»ý ¶Ç´Â À¯±â¹°Áú¿¡ ÀÇÇÑ ¹Ì¼¼°øÀÇ ¸·Èû (Clogged)Çö»ó¿¡ ´ëºñÇÏ¿© °ø±Þ¿ø¼öÀÇ ¿¬¼öÈ (Softning),Scale ¹æÁö¾àǰ (Anti-scalent solution)ÀÇ ÅõÀÔ ¹× Àüó¸® ¿©°úÇÊÅÍÀÇ »ç¿ë µî ÇöÀåÀÇ ¿ä°Ç¿¡ ¸Â´Â Á¤È®ÇÑ ¼³°è°¡ ÇÊ¿äÇÏ´Ù . |
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Á¾·¡ÀÇ º¹»ó½Ä À̿±³È¯ ÀåÄ¡ (Two-bed Deionization System) + È¥»ó½Ä À̿±³È¯ ÀåÄ¡ (Mixed-bed Deionization system)¹æ½ÄÀº , ÀæÀº Àç»ý (Regeneration)¿¡ ÀÇÇÑ ºñ°¡µ¿½Ã°£ (Shut down time), Àç»ý (Regeneration)¿¡ ÀÇÇÑ ºñ°¡µ¿½Ã°£ (Shut down time), Àç»ý ¾àǰºñ¿ëÀÇ °ú´ÙÁöÃâ ¹× Àη³¶ºñ
±×¸®°í ¸Å Àç»ý½Ã¸¶´Ù ¹ß»ýµÇ´Â ¾Ç¼ºÆó¼öÀÇ Ã³¸®¹®Á¦µî ¿©·¯°¡Áö ºÒÇÕ¸®ÇÑ ¿ä¼ÒµéÀ» ¾È°í ÀÖ´Ù .
¿ª»ïÅõ ÀåÄ¡ (Reverse Osmosis system) + È¥»ó½Ä À̿±³È¯ ÀåÄ¡ (Mixed-bed Deionization System)ÀÇ ¹æ½ÄÀº À̿Ͱ°Àº ¹®Á¦Á¡µéÀ» ȹ±âÀûÀ¸·Î º¸¿ÏÇÑ °ø¹ýÀÌ´Ù . ¶ÇÇÑ ¿¬±¸ . ½ÇÇè½Ç¿ëµîÀÇ ¼ÒÇü SystemÀÇ °æ¿ì , ÈÄ󸮷ΠºñÀç»ý ¹æ½Ä Å»À̿ ÀåÄ¡¸¦ »ç¿ëÇÏ¿© Polisher resinÀ» ÁÖ±âÀûÀ¸·Î ±³È¯ ÃæÁøÇÏ¿© ÁÜÀ¸·Î½á °í¼øµµÀÇ Ãʼø¼ö¸¦ Àç»ý°øÁ¤¾øÀÌ Áö¼ÓÀûÀ¸·Î »ý»êÇÒ ¼ö ÀÖ´Ù .
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| DESCRIOTION |
CAP |
ASTM |
ACS |
USP |
NCCLS |
| ¥° |
¥± |
¥² |
¥° |
¥± |
¥² |
¥³ |
¥° |
¥± |
¥² |
Conductance Micromhos/cm max. |
0.1 |
0.5 |
1.0 |
0.06 |
1.0 |
1.0 |
1.0 |
2.0 |
0.15 |
0.1 |
0.5 |
10 |
Resistivity
(ºñÀúÇ×)
Megohm
(§Û)/cm |
10 |
2.0 |
0.1 |
16.67 |
1.0 |
1.0 |
1.0 |
- |
1.0 |
- |
- |
- |
Total Matter
mg/L max. |
- |
- |
- |
0.1 |
0.1 |
0.1 |
2.0 |
- |
1.0 |
- |
- |
- |
Silicate §
/L max. |
50 |
100 |
10000 |
ND |
ND |
ND |
|
10 |
|
50 |
1000 |
1000 |
KMnO4
retention
(°ú¸Á°£»êÄ®·ý
¼Òºñ·® ) |
- |
- |
- |
60 |
60 |
10 |
10 |
60 |
10 |
- |
- |
- |
time minutes
min
Ammonia mg/L
max |
- |
- |
- |
- |
- |
- |
- |
- |
0.3 |
- |
- |
- |
Culture/
Colony Count |
10cf
m/m |
104cf
m/m |
no
lim it |
- |
- |
- |
- |
|
|
10cf
m/ml |
no
lim it |
no
lim it |
| pH |
not
used |
not
used |
5.0-
8.0 |
not
used |
not
used |
6.2-
7.5 |
5.0-
8.0 |
|
5.0-
7.0 |
not
used |
not
used |
5.0
-8.0 |
| Copper |
|
|
|
|
|
|
|
|
ND |
|
|
|
Filter Rotings,
Microns |
0.2 |
|
|
0.2 |
|
0.45 |
|
|
0.45 |
0.2 |
|
|
TOTAL MATTER
mg/L (Max.) |
- |
- |
- |
0.1 |
0.1 |
0.1 |
|
|
|
|
|
|
PARTICLE
( ¹Ì¸³ÀÚ )
EA/L
0.2§ (Max.) |
0.0 |
- |
- |
- |
- |
- |
- |
|
|
0.0 |
- |
- |
BACTERIA
(¼¼±Õ)
CFU/ml (Max.) |
10 |
104 |
- |
0 |
10 |
- |
- |
- |
- |
0.05 |
0.1 |
1.0 |
SiO2( ½Ç¸®Ä« )
mg/L (Max.) |
0.05 |
0.1 |
1.0 |
0.0 |
0.0 |
10.0 |
- |
- |
- |
- |
- |
- |
CAP( ¹Ì±¹º´¸®ÇÐÀÚ¿¬±¸È¸ )
College of American Pathologists
ASTM( ¹Ì±¹Ç¥ÁØÇùȸ )
American Society for Testing and Materials
ACS( ¹Ì±¹ÈÇבּ¸È¸ )
American Chemical Socity
USP( ¹Ì±¹¾àÇÐÀÚÇùȸ )
The United States Pharmacopia
NCCLS( ±¹¸³º´¸®½ÇÇè½ÇÇ¥ÁØÇùȸ )
National Committee for Cinical Laboratory Standard
¿¬±¸ , ½ÇÇè½Ç¿ë Ãʼø¼ö ¿ä±¸¼öÁú
°¢Á¾ ¿¬±¸ ¹× ½ÇÇèÀÇ ¸ñÀûÀ¸·Î »ç¿ëµÇ´Â Ãʼø¼ö´Â ±× ¿ëµµ¿Í Á¶°Ç¿¡ µû¶ó ¿ä±¸µÇ´Â ¼öÁúÀÇ ±âÁØÀÌ °¢±¹°¡ ¹×°ü·Ã±â°üº°·Î´Ù¼ÒÂ÷À̰¡ ÀÖ±â´ÂÇÏÁö¸¸¹Ì±¹ÀÇ °æ¿ì 3°¡ÁöÇüÅ (ASTM, CAP, NCCLS)ÀÇ µî±ÞÀ¸·Î ºÐ·ùÇϰí ÀÖ´Ù
¢ºType º° Á¤¸³
Type ¥°
Laboratory ultra-pure Water
¿øÀÚÀÇ °áÇÕ ÃøÁ¤ (Automic Absorption) ºÐ±¤ÃøÁ¤ (Flame Spectrometry) È¿¼Òó¸® ¿¬±¸ (Enzyme Studies). À¯Àü°øÇÐ ¿¬±¸ ¹× °íµµÀÇ ¹Ì»ý¹° ¿¬±¸ ½ÇÇè µî¿¡ »ç¿ëµÇ´Â Ãʼø¼ö·Î Àû¾îµµ Electrical Resistivity10§Û /cmÀÌ»óÀ̾î¾ß Çϸç TDS ȯ»êÄ¡´Â 50ppb ÀÌÇÏ ¸¦ ±âÁØ .
Type ¥±
Laboratory ultra-pure Water
Electrical Resistivity1.0 ¢¦ 2,0§Û /§¯Á¤µµÀÇ ¼ø¼ö·Î½á CAP Type¥± , ASMT Type¥±¢¦¥² ¶Ç´Â NCCLS ÀÇ Type ¥±¿¡ ÇØ´çÇÏ´Â °ÍÀ¸·Î ½ÇÇè ¼ö ³ª º¸´Ù ³ôÀº û°áÀ» ¿äÇÏ´Â À¯¸®Á¦Ç° ¹× ¿ë±âÀÇ ¼¼Ã´¿¡ »ç¿ëµÇ´Â µî±Þ±âÁØ .
Type ¥²
Laboratory ultra-pure Water
TDS 2.0 ¢¦ 5.0ppm(Electrical Resistivity0.1¢¦ 0.2§Û /§¯ )»çÀÌÀÇ ¼ø¼ö·Î , °£´ÜÇÑ ½ÇÇèÀ̳ª À¯¸®Á¦Ç°ÀÇ ½ÇÇè¿ë±¸ ¹× û°áÀ» ¿äÇÏ´Â °¢Á¾ ¿ë±âÀÇ ¼¼Ã´¿¡ ÀûÇÕÇÑ µî±ÞÀÌ´Ù .
CAP ÀÇ Type¥² , ASTMÀÇ Type¥³ ¶Ç´Â NCCLS ÀÇ Type¥² ¿¡ ÇØ´ç .
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¹ÝµµÃ¼ °ø¾÷ (Semi conductor)
¹ÝµµÃ¼ ¿þÀÌÆÛ (Micro-electronic wafer)¼¼Ã´¿ë Ãʼø¼ö .
(Silica, Microbe, Dissolved Oxygen, Pyrogen, Particle, CO2 , TOC µîÀÇ Á¦°Å )
ÃÊÀ½ÆÄ¼¼Ã´ (Ultra sonic cleaning)
ÃÊÀ½ÆÄ (Ultra sonic wave)ºÐ»ç ¼¼Ã´ ¹× Deeping °øÁ¤¿ë Ãʼø¼ö (Ca++ ¹× Silicaµî¿¡ ÀÇÇÑ ¿Ç³ ¶Ç´Â ÀÚ¿¬°ÇÁ¶½Ã ¹ß»ýÇÏ´Â SpottedÀÇ ¹æÁö )
-ÃÊÀ½ÆÄ (Ultra sonic wave)¼¼Ã´
ÃÊÀ½ÆÄÀÇ À½¾Ð°ú Cavitation(°øµ¿ÍöÔ×Çö»ó )À» ÀÌ¿ëÇÑ °í Á¤¹ÐµµÀÇ ±â°èÀû ¼¼Ã´ ¹æ¹ýÀÌ´Ù . Cavitatio n ¿¡ ÀÇÇØ ¹ß»ýÇÏ´Â ±âÆ÷ÀÇ Áøµ¿ ¶Ç´Â ±âÆ÷ÀÇ ºÐ¿¿¡ ÀÇÇØ , ¿·¯ ÇüÅÂÀÇ ¹°¸®Àû ¶Ç´Â ÈÇÐÀû ¿îµ¿ÀÛ¿ëÀÌ º¹ÇÕÀûÀ¸·Î ¹Ýº¹µÊÀ¸·Î½á ¼¼Ã´¾×ÀÇ ÈÇйÝÀÀÀÌ ÃËÁøµÇ°í ºÐ»êÀÛ¿ëÀÌ Áõ°¡ÇÏ¿© Á¤¹Ðµµ°¡ ¸Å¿ì ³ôÀº ¼¼Ã´ÀÌ ÀÌ·ç¾îÁø´Ù .
ÈÇаø¾÷ (Chemical Industries)
Ȱø¾àǰÀÇ Dilution ¹× ¿ë±â ¼¼Ã´¿ë Ãʼø¼ö ±Ý¼ÓÀ̿ -Cation-¹× ºñ±Ý¼ÓÀ̿ -Anion-ÀÇ »êÈ , ¹ÝÀÀµî¿¡ ÀÇÇÑ »ý»êÁ¦Ç°ÀÇ Congelation ¶Ç´Â DeteriorationÀÇ ¹æÁö )
Á¦¾à°ø¾÷ ¹× ÀÇ·áºÐ¾ß
(Pharmacy manufactures & Medical institutions)
¸µ°Ö , ±âŸ ÁÖ»ç¿ë Áõ·ù¾×ÀÇ Á¦Á¶ ¹× ÀÏȸ¿ë ÁÖ»ç±â µîÀÇ ÀǷḵ°Ö , ±âŸ ÁÖ»ç¿ë Áõ·ù¾×ÀÇ Á¦Á¶ ¹× ÀÏȸ¿ë ÁÖ»ç±â µîÀÇ ÀÇ·á¿ë±¸ Á¦Á¶°øÁ¤ÀÇ ¼¼Á¤ , ¶Ç´Â Àΰø½ÅÀå±â¿¡ ÀÇÇÑ ¿À¿°µÈ Ç÷¾×ÀÇ Á¤Á¦¿ë Ãʼø¼ö .(¼¼±Õ¿¡ ÀÇÇϳª °¨¿° ¹× Pyrogen¿¡ ÀÇÇÑ ºÎÀÛ¿ë ¹æÁö )
- Pyrogen( ¹ß¿¼º ¹°Áú )
´ëºÎºÐÀÇ PyrogenÀº ¹ÚÅ׸®¾ÆÀÇ ¼¼Æ÷º®À¸·ÎºÎÅÍ »ý¼ºµÇ¾îÁ® ³ª¿Â ´Ù´ç·ù (Polysaccharide)·Î¼ ´ë·«ÀûÀÎ Å©±â´Â 20,000MW·Î ºÎÅÍ 0.1§ÀÇ Á÷°æÀ» °®´Â ÁýÇÕüµé±îÁö ÀÖ´Ù . PyrogenÀº °¡¾Ð¸ê±Õ , Á¤¹Ð¿©°ú ¶Ç´Â ÈíÂø ¸Å°³¹°¿¡ ÀÇÇØ¼´Â ¿Ïº®ÇÏ°Ô Á¦°ÅµÇÁö ¾ÊÀ¸¸ç Çѿܿ©°ú (Ultra Filtration)µîÀÇ Æ¯¼öÇÑ ¿©°ú°úÁ¤¿¡ ÀÇÇØ¼¸¸ÀÌ Á¦°ÅµÉ ¼ö ÀÖ´Ù .
µµ·á°ø¾÷ (Paint industries)
¼ö¼º ÆäÀÎÆ® Á¦Á¶¿ë Ãʼø¼ö . (Oxidation¹°Áú¿¡ ÀÇÇÑ Deterioration ¹× CongelationÇö»óÀÇ ¹æÁö )
µµ±Ý°ø¾÷ (Plating industries)
Àü±â µµ±Ý¿ë Å»À̿¼ö . (¿ëÁ¸ ±Ý¼ÓÀ̿ -Cation- ¹× ºñ±Ý¼ÓÀ̿ -Anion-µî¿¡ ÀÇÇÑ µµÂøÀ²ÀÇ ÀúÇϹæÁö ¹× Dissolved Oxygen bubbling¿¡ ÀÇÇÑ µµ±Ý¸·ÀÇ Spotted Çö»óÀÇ ¹æÁö
½Äǰ°¡°ø (Food Proce ssing)
»êȹ°Áú ¹× ¹Ì»ý¹°¿¡ ÈñÇÑ »ý»êÁ¦Ç°ÀÇ ºÎÆÐ , º¯Áú¹æÁö ¶Ç´Â ÄÝ·ÎÀ̵幰Áú (Colloid matter)µî¿¡ ÀÇÇÑ Ã»·®À½·áÀÇ Pigment congelationÇö»óÀÇ ¹æÁö .
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